Title: Electroplated Multi-Path Compliant Interconnects for Flip-Chip Packages When: Monday, December 9, 2013 at 9:00 AM Where: MARC Building, Room 401
Event Subject
Electroplated Multi-Path Compliant Interconnects for Flip-Chip Packages
Event Speaker
Raphael Okereke
Event Location
MARC Building, Room 401
Event Date